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| CYStech Electronics Corp. PNP Epitaxial Planar Transistor Spec. No. : C655J3 Issued Date : 2008.07.25 Revised Date :2009.02.04 Page No. : 1/6 BTB1580J3 Description BVCEO IC RCESAT -120V -4A 600m The BTB1580J3 is a PNP Darlington transistor, designed for use in general purpose amplifier and low speed switching application. Pb-free package process is adopted. Equivalent Circuit BTB1580J3 C B 6K 8k Outline TO-252 60 E BBase CCollector EEmitter B C E Absolute Maximum Ratings (Ta=25C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Power Dissipation(TA=25) Power Dissipation(TC=25) Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Case Junction Temperature Storage Temperature Note : Single Pulse Pw300s, Duty2%. Symbol VCBO VCEO VEBO IC ICP Pd RJA RJC Tj Tstg Limits -120 -120 -5 -4 -6 1.5 20 83.3 6.25 150 -55~+150 Unit V V V A A W W C/W C/W C C BTB1580J3 CYStek Product Specification CYStech Electronics Corp. Characteristics (Ta=25C) Symbol BVCEO BVCBO ICBO ICEO IEBO *VCE(sat) *VBE(on) *hFE1 *hFE2 Cob Min. -120 -120 1000 500 Typ. Max. -1 -2 -2 -2 -2.8 200 Unit V V mA mA mA V V pF Spec. No. : C655J3 Issued Date : 2008.07.25 Revised Date :2009.02.04 Page No. : 2/6 Test Conditions IC=-1mA, IB=0 IC=-100A, IE=0 VCB=-100V, IE=0 VCE=-50V, IB=0 VEB=-5V, IC=0 IC=-2A, IB=-2mA VCE=-4V, IC=-2A VCE=-4V, IC=-1A VCE=-4V, IC=-2A VCB=-10V, IE=0A, f=1MHz *Pulse Test : Pulse Width 380s, Duty Cycle2% Ordering Information Device BTB1580J3 Package TO-252 (Pb-free) Shipping 2500 pcs / Tape & Reel Marking B1580 Recommended soldering footprint BTB1580J3 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Current Gain vs Collector Current 10000 Spec. No. : C655J3 Issued Date : 2008.07.25 Revised Date :2009.02.04 Page No. : 3/6 Saturation Voltage vs Collector Current 10000 Saturation Voltage---(mV) Current Gain---HFE 1000 VCE = 4V VCE (SAT)@IC=250IB 100 1000 10 1 1 10 100 1000 10000 100 1 10 100 1000 10000 Collector Current---IC(mA) Collector Current---IC(mA) Saturation Voltage vs Collector Current 10000 Saturation Voltage---(mV) VBE (SAT)@IC = 250IB On voltage---(mV) 10000 On voltage vs Collector Current VBE (ON) @VCE = 4V 1000 1000 100 1 10 100 1000 10000 Collector Current---IC(mA) 100 1 10 100 1000 10000 Collector Current---IC(mA) Power Derating Curve 1.6 Power Dissipation---PD(W) 25 20 15 10 5 0 Power Derating Curve 1.4 Power Dissipation---PD(W) 1.2 1 0.8 0.6 0.4 0.2 0 0 50 100 150 200 Ambient Temperature---TA() 0 50 100 150 200 Case Temperature---TC() BTB1580J3 CYStek Product Specification CYStech Electronics Corp. Reel Dimension Spec. No. : C655J3 Issued Date : 2008.07.25 Revised Date :2009.02.04 Page No. : 4/6 Carrier Tape Dimension BTB1580J3 CYStek Product Specification CYStech Electronics Corp. Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 C Spec. No. : C655J3 Issued Date : 2008.07.25 Revised Date :2009.02.04 Page No. : 5/6 Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat -Temperature Min(TS min) -Temperature Max(TS max) -Time(ts min to ts max) Time maintained above: -Temperature (TL) - Time (tL) Peak Temperature(TP) Time within 5C of actual peak temperature(tp) Ramp down rate Time 25 C to peak temperature Sn-Pb eutectic Assembly 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds 240 +0/-5 C 10-30 seconds 6C/second max. 6 minutes max. Pb-free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds 260 +0/-5 C 20-40 seconds 6C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BTB1580J3 CYStek Product Specification CYStech Electronics Corp. TO-252 Dimension Marking: A C Device Name Spec. No. : C655J3 Issued Date : 2008.07.25 Revised Date :2009.02.04 Page No. : 6/6 B L F G D B1580 Date Code 3 H E K 2 I 1 J Style: Pin 1.Base 2.Collector 3.Emitter 3-Lead TO-252 Plastic Surface Mount Package CYStek Package Code: J3 *: Typical DIM A B C D E F Inches Min. Max. 0.0177 0.0217 0.0650 0.0768 0.0354 0.0591 0.0177 0.0236 0.2441 0.2677 0.2125 0.2283 Millimeters Min. Max. 0.45 0.55 1.65 1.95 0.90 1.50 0.45 0.60 6.20 6.80 5.40 5.80 DIM G H I J K L Inches Min. Max. 0.0866 0.1102 *0.0906 0.0449 0.0346 0.2047 0.2165 0.0551 0.0630 Millimeters Min. Max. 2.20 2.80 *2.30 1.14 0.88 5.20 5.50 1.40 1.60 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: * Lead: KFC; tin plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTB1580J3 CYStek Product Specification |
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